Advanced Control System for CMP Equipment Using Beckhoff PLC and Decowell I/O Modules

Background:

Chemical-Mechanical Planarization (CMP) is a crucial process in semiconductor manufacturing, relying on the principle of chemical-mechanical dynamic coupling. This process efficiently removes excess materials from the wafer surface and achieves global nanometer-level flattening with ultra-high flatness, ensuring a surface deviation of less than 5nm. The CMP process consists of two primary stages: chemical and physical. By combining chemical corrosion and mechanical grinding, CMP equipment is vital for the removal of surplus materials and achieving the required global planarization in semiconductor production.

CMP equipment is one of the key technologies in semiconductor manufacturing, particularly in integrated circuit production. Its primary function is to achieve nano-level global flattening of the wafer surface, making it one of the most widely used devices in the semiconductor industry for surface manufacturing.

Solution:

Main Station: Beckhoff PLC
Applicable Process Stage: Chemical-Mechanical Polishing (CMP)
Project I/O Configuration: 8RS-EC2 + 916DI + 7*8DI8DO

In this solution, Beckhoff PLC integrates seamlessly with Decowell’s I/O modules to form a highly efficient CMP equipment control system. This system can receive signals from multiple types of sensors, including photoelectric and position sensors, to continuously monitor the performance of the wafer in real-time. The PLC utilizes these data inputs to precisely control various loads, such as electric drive systems and wafer conveyors, enabling precise polishing operations.

Key Benefits:

• Compact Design: The system is designed to be compact and space-efficient, making it suitable for environments with limited space.

• High-Speed Response: With a fast response time, the system can handle rapid adjustments during the polishing process, ensuring high production efficiency.

• Improved Production Efficiency: The system’s precise control over wafer movement and polishing parameters leads to enhanced throughput and higher overall production efficiency.

This integrated control system, combining Beckhoff PLC and Decowell I/O modules, optimizes CMP equipment performance, ensuring that semiconductor manufacturers can achieve the highest levels of precision and efficiency in their wafer planarization processes.