Project Background

CMP (Chemical Mechanical Polishing) equipment operates based on the synergy between chemical reactions and mechanical polishing. Through the combined action of chemical reagents and polishing pads, the system efficiently removes excess material from the wafer surface and achieves global planarization at the nanometer level (overall flatness deviation <5 nm).

CMP polishing integrates chemical processes and mechanical material removal, making it one of the most critical steps in semiconductor wafer fabrication. Its main purpose is to ensure high-precision surface smoothness, defect removal, and uniformity—essential for downstream lithography and device fabrication.

As a core technology widely used in integrated circuit manufacturing, CMP ensures ultra-flat wafer surfaces and directly influences yield, reliability, and long-term device performance.

Solution Overview

Main Controller: Beckhoff PLC
Applicable Process: Chemical Mechanical Polishing (CMP)
I/O Configuration:
8RS-EC2 + 916DI + 7*8DIBDO

Our solution uses a Beckhoff PLC paired with our custom-designed IO modules to build a high-precision, high-reliability CMP equipment control system. This control platform supports diverse sensor inputs, including:

• Photoelectric sensors

• Pressure sensors

• Position sensors

• Wafer surface condition monitoring

The PLC processes real-time sensor data to accurately regulate key subsystems such as motor drives, polishing head control, slurry distribution, wafer loading/unloading mechanisms, and end-point detection.

Project Description

This intelligent control system continuously tracks the wafer’s surface condition during the CMP process, ensuring precise material removal and uniformity across the entire wafer. Based on sensor feedback, the PLC performs precise load control and motion coordination, enabling stable polishing pressure, consistent slurry flow, and optimal mechanical dynamics.

Through advanced automation, the solution ensures:

• Stable planarization quality

• Sensitive response to process variations

• Higher wafer yield and uniformity

• Reduced manual intervention and maintenance

The reliable EtherCAT-based architecture guarantees high-speed communication between modules, making the system ideal for demanding semiconductor manufacturing environments.

Application Advantages

Compact Architecture, High Precision, Increased Production Efficiency

• High-speed EtherCAT communication ensures real-time control

• Flexible IO architecture adapts to multiple CMP equipment types

• Improved surface uniformity and defect reduction

• Enhanced productivity through intelligent, automated control

• Stable long-term operation suitable for 24/7 semiconductor fabs

This solution provides semiconductor manufacturers with a reliable and scalable CMP process control platform, helping improve overall yield and streamline wafer polishing operations.